Executive Director of R&D Engineering for 3DIC-Advance Packaging

We Are:

At Synopsys, we drive the innovations that shape the way we live and connect. Our technology is central to the Era of Pervasive Intelligence, from self-driving cars to learning machines. We lead in chip design, verification, and IP integration, empowering the creation of high-performance silicon chips and software content. Join us to transform the future through continuous technological innovation.

You Are:

You are a seasoned semiconductor leader with deep expertise in IC design and advanced packaging, including 3DIC technologies. You have successfully led complex, cross‑functional organizations and delivered differentiated silicon IP solutions from concept to execution.

You bring a strong strategic mindset, combining technical depth with a clear understanding of market dynamics and customer needs. You are known for translating complex technical challenges into actionable plans and for influencing across engineering, product, go‑to‑market, and customer‑facing teams in a highly matrixed, global environment.

You inspire, develop, and empower high‑performing teams. You foster a culture of collaboration, accountability, and continuous improvement, and you lead with credibility, clarity, and purpose to consistently exceed business and customer expectations.

What You’ll Be Doing:

• Leading 3DIC silicon IP and advanced packaging design and verification across layout, physical design, signal integrity, power integrity, thermal modelling management, and mechanical integrity for AI infrastructure and high‑performance computing products.
• Managing cross-functional collaboration with EDA tool development, Go-To-Market strategies, and Customer Success in utilizing Synopsys solutions.
• Keeping track of industry trends in the fast-changing field of 3DIC and semiconductor packaging to drive new product innovations.
• Ensuring developed solutions are in alignment with business objectives while delivering differentiated technical solutions.
•  Embodying a collaborative, supportive, and inspirational leadership style to deliver results that exceed expectations.

•  Comfortable in a matrixed, international, team-oriented environment with multiple stakeholders.

The Impact You Will Have:

• Driving the strategic technology development, planning, and execution of Silicon IP for 3DIC and advanced packaging solutions.
• Influencing and shaping the direction of Synopsys’ product offerings in the semiconductor industry.
• Playing a key role in advancing Synopsys’ 3DIC and advanced packaging leadership by contributing to the company’s long‑term technology roadmap.
•  Enhancing customer satisfaction by delivering state-of-the-art solutions that meet their needs.
• Contributing to the overall success and growth of Synopsys by leading high-impact projects.
• Fostering a culture of excellence and continuous improvement within your team.

What You’ll Need:

?B.S./M.S. in Electrical Engineering or a related technical discipline, or equivalent professional experience.

• 15+ years of experience in the semiconductor industry, with demonstrated depth in advanced packaging and 3DIC technologies.

• Deep hands‑on and organizationalexpertisein3DIC architectures, including chiplets, heterogeneous integration, and die‑to‑die interconnects.
• Strong command of3DIC‑specific design and signoff challenges, including signal and power integrity, thermal behavior, mechanical stress, reliability, and yield.
• Experience building, leading, and scaling large, multi‑site engineering teams, delivering complex 3DIC technologies from architecture through production.
• Ability to drive end‑to‑end silicon IP execution, making sound tradeoffs across performance, power, area, cost, and manufacturability.
• Capability to define technical vision and long‑term roadmap for 3DIC and advanced packaging, aligned with business strategy.
• Effectiveness in influencing across functions, partnering with EDA, product management, go‑to‑market, manufacturing, and customer success teams in a matrixed environment.
• Strong customer‑facing leadership, including direct engagement with leading customers and ecosystem partners to shape requirements and drive adoption.
• A customer‑centric mindset, strong execution discipline, and commitment to innovation and continuous improvement.