Advanced Packaging, Distinguished Architect

United States Off-site

Engineering

Employee

$218000-$328000

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Overview

Synopsys software engineers are key enablers in the world of Electronic Design Automation (EDA), developing and maintaining software used in chip design, verification and manufacturing. They work on assignments like designing, developing, and troubleshooting software, leveraging the state-of-the-art technologies like AI/ML, GenAI and Cloud. Their critical contributions enable world-wide EDA designers to extend the frontiers of semiconductors and chip development.

Job Description

Date posted 08/27/2026

Category Engineering Hire Type Employee Job ID 18426 Base Salary Range $218000-$328000 Remote Eligible Yes Date Posted 08/27/2026

Distinguished Engineer, Advanced Packaging Solutions

We Are

Synopsys delivers silicon-to-systems design solutions that help engineering teams build the next generation of AI-powered products. Our software, IP, simulation, and analysis platforms enable customers to solve complex design challenges across semiconductors, systems, and advanced packaging.

You Are

You have spent your career near the physical limits of semiconductor design, where architecture, manufacturability, and performance intersect. You understand that advanced packaging is now part of system architecture, not a downstream implementation step.

You think deeply about algorithms and data structures, but you have also shipped production software that real design teams depend on. At Synopsys, you will help shape package substrate design automation within 3DIC Compiler, enabling advanced multi-die systems for AI, high-performance computing, and heterogeneous integration.

What You'll Be Doing

Architect and drive package substrate design automation capabilities within the 3DIC Compiler platform.
Design and implement production-grade algorithms for HDI substrate auto-routing, design rule checking, power delivery network analysis, and design for manufacturability.
Build scalable C/C++ software for advanced packaging designs, including multi-die chiplets and heterogeneous integration.
Partner with customers, product teams, and R&D to translate design bottlenecks into durable technical solutions.
Lead architecture reviews and influence technical decisions across the 3DIC product portfolio.
Mentor engineers and raise the bar on algorithmic rigor, performance, and software quality.

The Impact You Will Have

Define capabilities that enable next-generation advanced packaging designs for AI, high-performance computing, and other complex systems.
Reduce design cycle time for customers working on HDI substrates, chiplets, and multi-die architectures.
Drive algorithmic advances in auto-routing, power delivery, and design for manufacturability.
Shape a strategic Synopsys product line used by leading semiconductor companies.

What You'll Need

Deep expertise in advanced packaging or package substrate design, routing, power delivery, and manufacturability.
Proven experience building production software products at scale.
Strong algorithmic foundation for physical design automation challenges.
Expert-level C/C++ skills for performance-critical, large-scale systems.
Experience in at least one related domain: custom IC design automation, auto-routing, physical verification, or substrate design tools.
Advanced degree in Computer Science, Electrical Engineering, or equivalent hands-on R&D experience.
Track record of technical leadership through architecture ownership, product influence, publications, or patents.

How You Think and Build

You see advanced packaging as a systems problem across substrate architecture, connectivity, signal and power integrity, thermal behavior, manufacturability, and tool performance.
You thrive in ambiguous technical problems where strong product judgment matters as much as algorithmic depth.
You translate customer pain into scalable software architecture.
You challenge assumptions with clarity, data, and respect.
You care about engineering craft: performance, maintainability, testability, and extensibility.

Why This Role Is Different

This is a chance to help define how engineering teams design, analyze, and sign off the next generation of multi-die systems. As AI, high-performance computing, and heterogeneous integration push beyond monolithic scaling, package architecture is becoming a primary driver of system performance.

You will have the technical latitude to build from first principles: smarter substrate automation, scalable routing, tighter analysis integration, and workflows that make advanced multi-die architecture practical for real design teams. For an engineer who wants to build rather than maintain, this role offers a visible imprint on a major transition in semiconductor design.

The Team You'll Be Part Of

You will be a key technical leader on the advanced packaging design automation team for 3DIC Compiler. The team is focused on package substrate design and the industry shift toward chiplet architectures and heterogeneous integration. Your work will directly shape the product roadmap and technical direction of a strategic Synopsys growth area.

Rewards and Benefits

Synopsys offers health, wellness, and financial benefits, including monetary and non-monetary rewards. Your recruiter will share compensation and benefits details during the hiring process.

#LI-MK1

At Synopsys, we want talented people of every background to feel valued and supported to do their best work. Synopsys considers all applicants for employment without regard to race, color, religion, national origin, gender, sexual orientation, age, military veteran status, or disability.

In addition to the base salary, this role may be eligible for an annual bonus, equity, and other discretionary bonuses. Synopsys offers comprehensive health, wellness, and financial benefits as part of a competitive total rewards package. The actual compensation offered will be based on a number of job-related factors, including location, skills, experience, and education. Your recruiter can share more specific details on the total rewards package upon request. The base salary range for this role is across the U.S.

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Benefits

At Synopsys, innovation is driven by our incredible team around the world. We feel honored to work alongside such talented and passionate individuals who choose to make a difference here every day. We're proud to provide the comprehensive benefits and rewards that our team truly deserves.

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Health & Wellness

Comprehensive medical and healthcare plans that work for you and your family.
Time Away

In addition to company holidays, we have ETO and FTO Programs.
Family Support

Maternity and paternity leave, parenting resources, adoption and surrogacy assistance, and more.
ESPP

Purchase Synopsys common stock at a 15% discount, with a 24 month look-back.
Retirement Plans

Save for your future with our retirement plans that vary by region and country.
Compensation

Competitive salaries.

** Benefits vary by country and region - check with your recruiter to confirm

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Hiring Journey at Synopsys

Apply

As an applicant your resume, skills, and experience are being reviewed for consideration.

Phone Screen

Once your resume has been selected a recruiter and/or hiring manager will reach out to learn more about you and share more about the role.

Interview

You will be invited to meet with the hiring team to measure your qualifications for the role. Our interviews are held either in person or via Zoom.

Offer

Congratulations! When you have been selected for the role, your recruiter will reach out to make you a verbal offer (a written offer will follow your conversation), and we hope you accept!

Onboarding

There will be some steps you need to take before you start to ensure a smooth first day, including new hire documentation.

Welcome!

Once you’ve joined, your manager, team, and a peer buddy will help you get acclimated. Over the next few weeks, you’ll be invited to join activities and training to help you ramp up for a successful future at Synopsys!

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