We Are:

At Synopsys, we drive the innovations that shape the way we live and connect. Our technology is central to the Era of Pervasive Intelligence, from self-driving cars to learning machines. We lead in chip design, verification, and IP integration, empowering the creation of high-performance silicon chips and software content. Join us to transform the future through continuous technological innovation.

You Are:

• You are an expert in advanced packaging technologies with a solid background in semiconductor manufacturing. 
• You have extensive experience with 3DIC, advanced packaging, and organic substrate technologies, as well as silicon interposer and substrate manufacturing processes. 
• You have a deep understanding of core and build-up material properties, thermal and multi-physics modeling, and simulation using Ansys tools. 
• You are knowledgeable about advanced packaging solutions offered by various foundries and OSATs, and have hands-on experience with wafer bumping, package assembly, and substrate technology. 
• Your strong communication skills and team player mentality make you an asset in a collaborative, global team environment. 
• Bachelor/Master of Science in physics, materials, mechanical, chemical, or electrical engineering. MS or PhD preferred
• Minimum of 15+ years of relevant experience in semiconductor manufacturing, packaging or related field
• Mandarin speaking is required for this role.

What You’ll Be Doing:

• Interfacing with foundries and OSATs for 3DIC and advanced packaging vendor evaluation, technology selection, feasibility studies, design, manufacturing, assembly, testing, and qualification.
• Driving internal cross-functional teams for 3DIC, interposer, and substrate design and development from a packaging technology perspective.
• Performing thermal simulations for IP sign-off and developing integration design guidelines and best practices.
• Driving IP and chiplet development from DFM and DFR perspectives, including material selection, cross-section, die thickness, die-stacking, TSV placement, and bonding pad design.
• Leading internal 3DIC tool feature development and validation to meet IP group needs.
• Conducting market studies of emerging packaging technology developments, competitive analysis, and making recommendations for our package development direction.
• Providing pre- and post-IP sale packaging technology support.

The Impact You Will Have:

• Enhancing Synopsys' capability in advanced packaging technologies.
• Ensuring the reliability and performance of Synopsys IP and test chips through advanced packaging solutions.
• Driving innovation in 3DIC and packaging technologies, contributing to Synopsys' leadership in the semiconductor industry.
• Supporting customers in exploring and optimizing their packaging solution space.
• Facilitating the successful integration of Synopsys tools and technologies in customer projects.
• Contributing to the development of industry-leading design guidelines and best practices in packaging technology.

What You’ll Need:

• Domain expertise in 3DIC, advanced packaging, and organic substrate technology, including silicon interposer and substrate manufacturing processes, assembly flow, functional and reliability tests, and qualification.
• Deep understanding of core and build-up material mechanical/electrical properties, trade-offs, CTE mismatch, TSV impact on warpage, stress, reliability, and Chip Package Interaction (CPI).
• Experience with thermal and multi-physics modeling and simulation using Ansys tools.
• Knowledge of advanced packaging and 3DIC offerings from various foundries and OSATs.
• Experience with 2.5D/3D/3.5D heterogeneous integration technologies such as SoIC, CoWoS, WoW, EMIB, xCUBE, and OSAT solutions.
• Hands-on experience with wafer bumping, package assembly, substrate technology, BOM selection, testing, and product development lifecycle.

Who You Are:

• A strong communicator and team player.
• Capable of working independently with minimal supervision.
• Adept at handling significant and unique issues requiring complex evaluation.
• Effective in communicating with both internal and external stakeholders.
• Possessing extensive expertise and a commitment to contributing to organizational objectives.

The Team You’ll Be A Part Of:

You will be part of a global, highly skilled, and supportive team focused on driving advancements in 3DIC and advanced packaging technologies. Our team collaborates closely with various departments to develop innovative solutions and optimize design flows, ensuring the successful implementation of Synopsys tools and technologies in customer projects.