At Synopsys, we drive innovations that shape the way people work and live. As a member of the Applications Engineering team, you will work closely with semiconductor, advanced packaging, AI infrastructure, and electronics system customers to enable next-generation product development through simulation, digital engineering, and AI-driven workflows.

This role combines deep engineering expertise, customer engagement, and solution consulting. You will help customers deploy industry-leading simulation technologies, engineering automation platforms, and AI-enabled design workflows to accelerate innovation across semiconductor packaging, AI servers, high-performance computing (HPC), and complex electronic systems.

The ideal candidate possesses strong technical knowledge in simulation technologies, excellent communication skills, and practical experience working with semiconductor manufacturers, OSATs, or leading system companies.

Key Responsibilities

Technical Consulting & Customer Success

• Provide technical leadership and application support for simulation-driven design and engineering workflows.
• Work directly with customer engineering teams to understand design challenges and develop effective technical solutions.
• Deliver software evaluations, proof-of-concepts (PoCs), benchmarks, and customer demonstrations.
• Support strategic accounts and help customers maximize the value of Synopsys solutions.
• Drive customer adoption and deployment of advanced simulation methodologies.

Semiconductor & Advanced Packaging Applications

• Support semiconductor and advanced packaging customers in solving complex thermo-mechanical and reliability challenges.
• Develop application methodologies for:
  • Advanced Packaging
  • CoWoS
  • Chiplet Architectures
  • Hybrid Bonding
  • Fan-Out Packaging
  • Heterogeneous Integration
  • AI/HPC Package Development
• Conduct engineering studies related to:
  • Warpage Prediction
  • Thermo-Mechanical Reliability
  • Stress Analysis
  • Fatigue and Life Prediction
  • Material Characterization
  • Process-Induced Deformation

AI-Driven Engineering & Workflow Automation

• Collaborate with customers to establish AI-powered engineering workflows and automation frameworks.
• Drive adoption of AI-assisted simulation and design optimization technologies.
• Support implementation of:
  • Engineering Automation
  • AI Agents for Engineering Applications
  • Design Exploration
  • Surrogate Modeling
  • Machine Learning-based Optimization
  • Digital Engineering Platforms
• Develop workflow automation solutions using scripting and programming tools such as Python.

Multi-Physics Simulation & System Design

• Apply simulation technologies across:
  • Structural Analysis
  • Thermal Management
  • Computational Fluid Dynamics (CFD)
  • Vibration and Dynamic Analysis
  • Electronics Cooling
  • System-Level Engineering
• Assist customers in developing digital twin and model-based engineering methodologies.

Cross-Functional Collaboration

• Work closely with R&D, Product Management, Sales, and Global Applications Engineering teams.
• Provide technical feedback and market requirements to product development organizations.
• Participate in customer visits, executive meetings, technical workshops, and industry conferences.
• Contribute to technical publications, best practices, and knowledge-sharing activities.

Requirements

Education

• M.S. or Ph.D. degree in: 
  • Mechanical Engineering
  • Materials Science
  • Aerospace Engineering
  • Electrical Engineering
  • Computer Engineering
  • Applied Physics
  • Related Engineering Disciplines

Experience

• 5+ years of industry experience in semiconductor, advanced packaging, electronics systems, simulation software, or related engineering fields.
• Hands-on experience supporting engineering teams in semiconductor manufacturing, OSAT, IC design, HPC, AI server, electronics, or system development environments.
• Experience interacting with customers in technical consulting, application engineering, or solution deployment roles is highly preferred.

Technical Qualifications

Candidates should possess experience in one or more of the following areas:

Simulation Technologies

• Finite Element Analysis (FEA)
• Structural Mechanics
• Reliability Engineering
• Fatigue Analysis
• Vibration & Dynamics
• Multi-Physics Simulation

Semiconductor & Packaging

• Advanced Packaging Technologies
• Chiplet Integration
• Heterogeneous Integration
• Thermal/Mechanical Reliability
• Wafer-Level Packaging
• Package Warpage
• Manufacturing Process Simulation

AI and Engineering Automation

• Engineering Workflow Automation
• AI/ML Applications for Engineering
• Surrogate Modeling
• Design Space Exploration
• Data Analytics
• Python Programming
• AI Agents / LLM-enabled Engineering Workflows

Computing Environment

• Linux Environment
• HPC Clusters
• Parallel Computing
• Cloud-based Engineering Platforms

Preferred Qualifications

• Experience with Synopsys, Ansys, Abaqus, Siemens, Cadence, or equivalent engineering simulation platforms.
• Knowledge of AI infrastructure, GPU systems, server design, or data center technologies.
• Experience in model-based systems engineering (MBSE), digital twins, or digital engineering initiatives.
• Familiarity with semiconductor ecosystem leaders, foundries, OSATs, and electronics manufacturing workflows.
• Strong presentation skills with the ability to communicate complex technical concepts to both engineering and executive audiences.
• Self-driven, customer-focused, and capable of leading highly visible technical engagements.

Success in This Role

A successful candidate will:

• Become a trusted technical advisor to key semiconductor and electronics customers.
• Drive adoption of simulation-led product development methodologies.
• Enable AI-driven engineering transformation initiatives.
• Influence next-generation semiconductor packaging and system design technologies.
• Help customers accelerate innovation while improving product reliability, engineering productivity, and time-to-market.