Advanced Packaging & 3DIC R&D Engineer, Principal

Category Engineering Hire Type Employee Job ID 13944 Remote Eligible No Date Posted 07/01/2026

We Are:  

At Synopsys, we drive the innovations that shape the way we live and connect. Our technology is central to the Era of Pervasive Intelligence, from self-driving cars to learning machines. We lead in chip design, verification, and IP integration, empowering the creation of high-performance silicon chips and software content. Join us to transform the future through continuous technological innovation.  

You Are:  

•You are an expert in 3DIC and advanced packaging technologies with a solid background in BEOL wafer processing, die stacking and flip chip assembly 

•You are knowledgeable about advanced packaging solutions offered by various foundries and OSATs 

•You have experience working with latest Si photonics optical packaging and assembly. 

•You have advanced packaging design experience and Design Technology Co-Optimization (DTCO) 

•Your strong communication skills and team player mentality make you an asset in a collaborative, global team environment  

•Bachelor/Master of Science in physics, optics, materials, mechanical, chemical, or electrical engineering. MS or PhD preferred 

•Minimum of 10+ years of relevant experience in packaging, physical design implementation, fiber array attachment, optical connector, or related field 

What You’ll Be Doing:  

•Interfacing with foundries and OSATs for 3DIC and advanced packaging vendor evaluation, technology selection, feasibility studies, design, manufacturing, assembly, testing, and qualification. 

•Driving internal cross-functional teams for 3DIC, interposer, and substrate design and development from a packaging technology perspective 

•Performing prototype design of advanced packaging and related simulations. (3DIC Design) 

•Driving IP and chiplet development from DFM and DFR perspectives, including material selection, cross-section, die thickness, die-stacking, TSV placement, and bonding pad design 

•Leading internal 3DIC tool feature development and validation to meet IP group needs 

•Conducting market studies of emerging packaging technology developments, competitive analysis, and making recommendations for our package development direction 

•Providing pre- and post-IP sale packaging technology support 

The Impact You Will Have:  

•Enhancing Synopsys' capability in advanced packaging design and technologies 

•Ensuring the reliability and performance of Synopsys IP and test chips through advanced packaging solutions 

•Driving innovation in 3DIC and packaging technologies, contributing to Synopsys' leadership in the semiconductor industry 

•Supporting customers in exploring and optimizing their packaging solution space 

•Facilitating the successful integration of Synopsys tools and technologies in customer projects 

•Contributing to the development of industry-leading design guidelines and best practices in packaging technology 

What You’ll Need: 

•Domain expertise in 3DIC, advanced packaging, and organic substrate technology, including silicon interposer and substrate manufacturing processes, assembly flow, functional and reliability tests, and qualifications 

•Knowledge of advanced packaging and 3DIC offerings from various foundries and OSATs, Experience with 2.5D/3D/3.5D heterogeneous integration technologies such as SoIC, CoWoS, WoW, EMIB, xCUBE, FoCoS, FoEB and OSAT solutions 

•Experience with optical, electrical, and thermal mechanical modeling and simulation using Ansys tools (Zemax, Lumerical, AEDT) 

•Experience with physical design tools is preferred (ICC2, Fusion Compiler, 3DIC Compiler, Custom Compiler or equivalent tools)  

•Hands-on experience with wafer bumping, package assembly, substrate technology, BOM selection, testing, and product development lifecycle 

Who You Are:  

•A strong communicator and team player 

•Capable of working independently with minimal supervision 

•Adept at handling significant and unique issues requiring complex evaluation 

•Effective in communicating with both internal and external stakeholders 

•Possessing extensive expertise and a commitment to contributing to organizational objectives

At Synopsys, we want talented people of every background to feel valued and supported to do their best work. Synopsys considers all applicants for employment without regard to race, color, religion, national origin, gender, sexual orientation, age, military veteran status, or disability.